Upaya Perbaikan Cacat Bond Gap pada Sandal Slide Indosole di PT Daimatu Industry Indonesia

Inge Novell Mahardika, - (2025) Upaya Perbaikan Cacat Bond Gap pada Sandal Slide Indosole di PT Daimatu Industry Indonesia. Tugas Akhir thesis, Politeknik ATK.

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Abstract

The final project discusses the bond gap defect found in the strap-to-sole joint of indosole slide sandals at PT Daimatu Industry Indonesia. The defect occurs due to several factors, particularly the absence of primer application on the spandex side, and makes bonding with EVA less effective. In addition, the manual pressing process leads to insufficient and inconsistent pressure, resulting in unstable bond quality. Field observations revealed that the average bond gap defect rate reached nearly 20% of total production, a figure considered high for mass production. This condition has the potential to reduce production efficiency. As a solution, it is recommended to apply primer on both materials (EVA and spandex), provide training for additional workers to improve process consistency, and strengthen early-stage quality control. With these improvements, the bond gap defect rate can be reduced, and the overall quality of Indosole slide sandals can be enhanced. Keywords: bond gap, primer, EVA, spandex

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